Experimental Investigations on Board Level Electronic Packages Subjected to Sinusoidal Vibration Loads. International Journal of Current Engineering and Technology, [S. l.], v. 1, n. 2.Special Issue, p. 427–431, 2014. Disponível em: https://ijcet.evegenis.org/index.php/ijcet/article/view/3680. Acesso em: 26 apr. 2026.